同时溶解和ICP-AES同时测定铜基锡银焊料中的锡和银

Simultaneous Dissolution of Tin and Slive in Copper Solder and Determination by ICP-AES

摘要: 提出了简单、快速地同时溶解及测定铜基锡银焊料中锡银的新方法.合金样品经2 g酒石酸和8 mL稀硝酸溶解后,用电感耦合等离子发射光谱仪法(ICP-AES)同时测定溶液中的锡和银.回收率为98%～102%,RSD为0.9%～2.1%.

Abstract: A new method for the simultaneous dissolution and determination of tin and silver in copper solder was reported.The sample was dissolved with 2 g of tartaric acid and 8 mL of nitric acid,tin and silver were simultancously determined by ICP-AES.The recoveries of the elements were in the range of 98%~102%,and the RSD,0.9%~2.1%.