火灾中铜导线及其熔珠显微结构的SEM分析

SEM Analysis of Microstructure of the Copper Wire Melted Bead and Trace in the Fire Disaster

  • 摘要: 用SEM观察分析了在各种模拟实验条件下铜导线及其熔珠熔痕的几种显微组织结构特征,结果表明:单股粗铜导线的火烧、二次短路熔珠熔痕与一次短路、过负荷、接触不良造成的熔珠熔痕其显微结构有明显不同,可为火灾原因的鉴定提供参考依据.而多股细铜导线火烧和二次短路及过负荷产生的熔珠熔痕,其显微结构中均出现等轴晶和柱状晶及较小再结晶颗粒,与一次短路结构较难以区别,因此无法为火灾原因的鉴定提供依据.

     

    Abstract: The microstructure feature of the copper wire and the melted bead and trace in several condations of simulated test were analyzed in this paper. The results reveal that the microstructure of the single wide copper wire melted bead and trace in the fire burned and second short circuit is different from the first short circuit and over load and poor contact. It would provide reference evidence for the fire disaster cause appraisal. But for the copper formed of more thin wire, there are all columnar crystal and equiaxle crystal and small recrystal pellet in the microstructure of copper wire melted bead and trace in the fire burned and second short circuit and in the first short circuit and over load and poor contact. So it wouldn't provide reference evidence for the fire disaster cause appraisal.

     

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