电感耦合等离子体原子发射光谱法同时测定铜基低银焊料中的银、磷和锡

Simultaneous Determination of Ag, P and Sn in Copper Alloy by Inductively Coupled Plasma Atomic Emission Spectrometry

摘要: 采用王水消解铜基低银焊料样品，选择Ag 328.0 nm、P 178.2 nm、Sn 189.9 nm作为分析线，建立了电感耦合等离子体原子发射光谱法（ICP-AES）同时测定铜基低银焊料中银、磷和锡元素的分析方法.在选定的试验条件下，方法检出限为0.002 4%~0.004 8%（质量分数），各元素校准曲线线性相关系数均大于0.999 5.按照试验方法测定样品，加标回收率为95%~103%，测定结果的相对标准偏差（RSD，n=10）均小于5%.

Abstract: A method for the simultaneously determined of Ag, P and Sn in copper-based solder of low silver was developed using inductively coupled plasma atomic emission spectrometry(ICP-AES)with Ag 328.0 nm, P 178.2 nm, Sn 189.9 nm as analysis lines.The samples were dissolved in aqua regia solution. Under the selected experimental conditions, the detection limit of the method was 0.002 4%~0.004 8% (mass fraction), all the linear correlation coefficients of calibration curves of each element were greater than 0.999 5. According to the test method, the recovery of standard addition was 95%~103%, and the relative standard deviation (RSD, n=10) of the results was less than 5%.